Sputtering technology is one of the main technologies for preparing thin film materials. It uses the ions produced by the ion source to accelerate and gather in vacuum to form a highspeed ion beam, bombard the solid surface, and the ions exchange kinetic energy with the atoms on the solid surface, so that the protons on the solid surface leave the solid and deposit on the substrate surface. The bombarded solid is the raw material for depositing thin films by sputtering method, which is called sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, flat panel displays and workpiece surface coatings.
As one of the three processes of vacuum coating, sputtering coating is widely used in photovoltaic, TFT-LCD and other modern industries. Sputtering targets have high requirements for purity. Generally, tungsten molybdenum sputtering targets require purity of more than 99.95%, and have good density and corrosion resistance.
Our advantages
Name | Power(W/cm2) | Substrate temperature(℃) | Rate(A·m/min) | Specific resistance@2000A(μΩcm) |
Molybdenum target | 5.0 | 100.0 | 342.8 | 11.7 |
Our products
Processing range | Thickness / diameter(mm) | Width(mm) | Long(mm) | Roughness(mm) |
G4.5~11.5 target | 1.5~40 | 1.0~2500.00 | 1.0~4000.00 | Ra0.2~6.4 |
Molybdenum tube target | 120~170 | / | 3500 | Ra0.2~6.4 |
It can completely eliminate the internal structural stress of the material, give full play to the best performance of the material, and make the material easier for subsequent machining.
Application | Tungsten products | Molybdenum products | Information |
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